NanoWork® stencils produced by LaserJob are based on the manufacture of laser-cut SMD stencils. The NanoWork® coating is applied to the underside (PCB side) of the stencil and into the apertures. For this purpose, the cutting burr on the laser exit side must first be removed; this is done by post-processing the cut stencil using a CNC-controlled brush. The squeegee side is not coated to prevent any impact on the rolling behavior of the solder paste. The maximum layer thickness is 2 μm.
Micrograph NanoWork® stencil:
The NanoWork® coating is characterized by anti-adhesive properties that greatly reduce the adhesion of solder paste. This anti-adhesive effect in the apertures results in significantly better contour sharpness and a significantly higher and more consistent transferred solder paste volume. The result is greater process reliability and a lower soldering error rate during the placement and soldering process. Transferred solder paste deposits remain constant throughout the entire printing process. Cleaning cycles on the underside of the stencil are greatly reduced due to the NanoWork® coating, which prevents solder paste from sticking. As a result, more printing cycles can be performed without cleaning steps. With the help of LaserJob's NanoWork® coating, finer structures can be achieved without compromising print quality.
LaserJob is therefore helping to meet the increasing demands for miniaturization:
- optimized aspect ratio and surface area ratio
- significantly fewer cleaning cycles for the underside of the stencil
- better contour sharpness
- excellent release behavior
- consistent solder volume transfer
The following graphic shows the release behavior of a NanoWork® stencil compared to a laser-cut stainless steel stencil, using a BGA component as an example. The apertures of 400 to 250 μm are shown in relation to the surface area. With an area ratio of 0.5, up to 80% of the solder paste volume is transferred with a NanoWork® stencil, with adjusted solder powder grain size. On the other hand, an uncoated laser-cut stainless steel stencil only achieves 50% using solder powder grain size 3 (25–45 μm) and less than 70% using solder powder grain size 4 (20–38 μm). This example clearly illustrates the advantage of a Nano-Work stencil.
The transfer efficiency of a NanoWork® stencil compared to uncoated laser-cut stainless steel stencils is illustrated using the example of a QFP structure (400 μm). In this case, 16 printing cycles were performed without cleaning the underside of the stencil, and the volume of solder paste transferred was recorded. As the diagram illustrates, a NanoWork® stencil can transfer 100–110% solder paste consistently throughout the entire printing cycle, while the uncoated stencil's transfer volume increases to 130% due to increasing pollution of the underside. The transfer efficiency of the uncoated stencil differs significantly from that of the NanoWork® stencil.
QFP-Struktur (400µm)
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